Luceda Photonics Introduces Assembly Design Kit (ADK) for the PHIX Characterization Package

November 6, 2023 by
Luceda Photonics Introduces Assembly Design Kit (ADK) for the PHIX Characterization Package
Luceda Photonics

Dendermonde, Belgium and Enschede, The Netherlands – November 6th 2023  

Luceda Photonics is proud to announce the launch of the Assembly Design Kit (ADK) for the PHIX Characterization Package, a packaging solution provided by PHIX Photonics Assembly, a renowned provider of assembly and packaging services for photonic integrated circuits (PICs). 

The implementation of the PHIX ADK in the Luceda Photonics Design Platform enables designers to create their photonic integrated circuits using Luceda's IPKISS software while incorporating packaging rules and constraints from the outset. This integrated approach ensures that circuits can be efficiently packaged after fabrication, eliminating costly mistakes and reducing time-to-market. 

The creation of this ADK aligns with the objectives of the photonixFAB consortium led by X-FAB, in which Luceda Photonics and PHIX are partners. This project, co-funded by the European Union, aims to strengthen the European photonics device value chain. The PHIX ADK for Luceda’s IPKISS software helps lower the barrier for making manufacturable photonic integrated circuit designs and facilitates a smooth scale-up to volume manufacturing of photonic devices. 

"Luceda Photonics is committed to advancing photonic design technology, and with the ADK for the PHIX Characterization Package we set steps towards design-for-test and design-for-assembly," said Pieter Dumon, CTO at Luceda Photonics. "By seamlessly integrating design and packaging considerations, we empower our customers to make smarter and more efficient decisions throughout the product development process." 
Jeroen Duis, Chief Commercial Officer at PHIX, adds, “Taking assembly and packaging into account already at the PIC design stage is crucial for making the manufacturing of photonic devices cost-effective, fast, and scalable. That is why our PHIX Characterization Package comes with a set of clearly defined PIC design rules that promotes design for manufacturability. Having these design rules incorporated into design software is a very powerful way to support the PIC designer in a key stage of product development, so we applaud Luceda Photonics for taking this important step!”  


The Luceda ADK for PHIX features the most recent PHIX Characterization Package, an open architecture prototyping platform for PICs and PIC based optoelectronic modules, offering: 

  • Support for a wide range of PIC dimensions, materials, and bond pad configurations. This flexibility allows designers to explore new possibilities, ensuring that their photonic solutions meet the unique needs of their projects. 

  • Documented assembly design rules, which can be automatically considered when designing photonic integrated circuits with Luceda IPKISS. 

  • Fan-out PCBs on ribbon cables for plug-and-play system integration. This feature streamlines the connection of different PICs and modules, reducing setup time and enhancing overall system performance. 

What are you waiting for? Download the Luceda Photonics Design Platform and the Luceda ADK for the PHIX Characterization Package and start developing your next disruptive product! For more information and to access the ADK, click below. 

ACCESS THE ADK

About Luceda Photonics

Luceda Photonics is a leading provider of photonic integrated circuit (PIC) design software and services. The Luceda Photonics Design Platform enables designers to design, simulate, and optimize photonic integrated circuits (PICs) and empowers photonic designers to quickly achieve their tape-out, getting their designs right the first time. For more information, visit www.lucedaphotonics.com.   

About PHIX

PHIX is a world leading packaging and assembly foundry for photonic integrated circuits (PICs), building optoelectronic modules based on all major PIC technology platforms in scalable manufacturing volumes. We specialize in chip-to-chip hybrid integration, coupling to fiber arrays, and interfacing of DC and RF electrical signals. By offering our knowledge already at the chip design stage, we ensure ease of scale-up for volume manufacturing and provide a one-stop-shop for PIC assembly. For more information, visit www.phix.com.  

Media Contacts


Luceda Photonics
Deren Baysal
deren@lucedaphotonics.com

PHIX Photonics Assembly 
Gijs van Ouwerkerk 
g.vanouwerkerk@phix.com 


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