Design for Packaging: Using the PHIX ADK for LiDAR and Datacom (English)


Registrations are closed

Design for Packaging: Using the PHIX ADK for LiDAR and Datacom (English)


Design for packaging is an important concept in PIC design as it allows you to consider the rules and constraints for packaging from the outset. This is achieved with an Assembly Design Kit (ADK). This integrated approach ensures that circuits can be efficiently packaged after fabrication, eliminating costly mistakes.

In this webinar, you will learn how to design PICs for packaging using the PHIX ADK for LiDAR and Datacom applications. PHIX will introduce you to the PHIX Characterization package, and Luceda will talk about the design for packaging using Luceda and the PHIX ADK.  

Register now to explore more about design for packaging, and see a live demonstration of the design of an optical phase array (OPA) and an IQ modulator ready for assembly!




Andrea Alippi
Product Manager
at PHIX Photonics Assembly 

Craig Godbold
Application Engineer
at Luceda Photonics

Li Biao
PDK Engineer
at Luceda Photonics


Registrations are closed
Date & Time
Tuesday, May 7, 2024
5:00 PM 6:00 PM (Europe/Brussels)

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Luceda Photonics

+32 52 33 98 38

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