Beyond Silicon: Advanced Materials for Modulation

Speaker

Moderators

As data centers, AI clusters, and telecom networks demand faster speeds and lower power consumption, traditional silicon photonics is hitting its physical limits. The solution may lie in a new wave of advanced materials.

Join us for Luceda's webinar series, where we'll focus on advanced photonic modulation materials and the innovative companies bringing them to market. At the forefront of photonic modulation, we’re sitting down with industry leaders working with advanced electro-optic materials, from Thin-Film Lithium Niobate (TFLN) to cutting-edge polymers and plasmonics, to explore how they are pushing the boundaries of bandwidth, footprint, and energy efficiency. 

In our second session, we welcome OpenLight Photonics, a pioneer in heterogeneous silicon photonics. OpenLight will introduce its heterogeneous III-V-on-silicon platform, which integrates active components, including lasers, optical amplifiers, and high-speed modulators, directly into silicon photonic integrated circuits. The presentation will explore how heterogeneous integration is enabling higher-performance, more scalable, and energy-efficient photonic solutions for next-generation AI and data center optical interconnects.

In this webinar, you'll:

• Learn about the unique advantages of emerging modulation materials and how they overcome current PIC bottlenecks.
• Explore how these materials are being successfully integrated into commercial foundry processes and design workflows.
• Hear directly from the companies actively scaling these technologies for the market, and ask them about their roadmaps.
  
  

Whether you are a PIC designer, a systems architect, or a technology scout, this series will give you a front-row seat to the material innovations defining the next decade of integrated photonics. Register now and don’t miss the opportunity to learn more about advanced materials for high-performance photonic modulators!