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报名开始时间: 九月 08, 2026, at 12:00 下午 (US/Eastern 时间)


Beyond Silicon: Scaling Terabit AI Interconnects: Ultra-Low-Power Silicon-Organic Hybrid Photonics for Next-Generation Data Centers

Webinar

演讲嘉宾

Moderator

Dr. Brad Booth 

CEO 
at NLM Photonics

Dr. Matthew Delaney

Business Development Manager – North America 
at Luceda Photonics

Dr. Kevin McComber

CEO & Co-founder
at Spark Photonics

As data centers, AI clusters, and telecom networks demand faster speeds and lower power consumption, traditional silicon photonics is hitting its physical limits. The solution may lie in a new wave of advanced materials.

Join us for Luceda's webinar series, where we'll focus on advanced photonic modulation materials and the innovative companies bringing them to market. At the forefront of photonic modulation, we’re sitting down with industry leaders working with advanced electro-optic materials, from Thin-Film Lithium Niobate (TFLN) to cutting-edge polymers and plasmonics, to explore how they are pushing the boundaries of bandwidth, footprint, and energy efficiency. 

In our third session, we welcome NLM Photonics, a pioneer in polymer silicon-organic-hybrid (SOH) photonics.  As AI clusters and cloud data centers push toward multi-terabit interconnects, traditional optical modulators face steep trade-offs among bandwidth, drive voltage, and energy consumption. This presentation details how NLM Photonics leverages SOH technology to deposit proprietary electro-optic materials onto standard silicon photonics, achieving sub-1V switching, wide optical bandwidth, and minimal insertion loss. Attendees will gain insight into scalable, foundry-compatible manufacturing pathways, co-packaged optics architectures, and practical roadmaps for deploying ultra-efficient 1.6T and 3.2T optical engines.

In this webinar, you'll:

  • Learn about the unique advantages of emerging modulation materials and how they overcome current PIC bottlenecks.
  • Explore how these materials are being successfully integrated into commercial foundry processes and design workflows.
  • Hear directly from the companies actively scaling these technologies for the market, and ask them about their roadmaps.

Whether you are a PIC designer, a systems architect, or a technology scout, this series will give you a front-row seat to the material innovations defining the next decade of integrated photonics. Register now and don’t miss the opportunity to learn more about advanced materials for high-performance photonic modulators!


日程安排

 5 mins   - Welcome & Introduction
                   Dr. Matthew Delaney - Business Development Manager (North America) at Luceda Photonics 

30 mins  - NLM Photonics: "Scaling Terabit AI Interconnects: Ultra-Low-Power Silicon-Organic Hybrid Photonics for Next- ​Generation Data Centers”
                   Dr. Brad Booth - CEO at NLM Photonics

10 mins  - Q&A and Closing Remarks
                  Dr. Kevin McComber - CEO & Co-founder at Spark Photonics

报名开始时间: 九月 08, 2026, at 12:00 下午 (US/Eastern 时间)
Date & Time
2026年9月16日星期三
14:00 15:00 (US/Eastern)

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Online event

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组织者

Luceda NV, Dawson Bonneville

4167293976
dawson.bonneville@lucedaphotonics.com
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