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VERSION:2.0
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TZID:Asia/Shanghai
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DTSTART:20000101T000000
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BEGIN:VEVENT
UID:20260526T022953Z - 2192@eupp208
DTSTART;TZID=Asia/Shanghai:20240507T150000
DTEND;TZID=Asia/Shanghai:20240507T160000
CREATED:20260526T022953Z
DESCRIPTION:<a href="https://www.lucedaphotonics.com/event/design-for-packa
 ging-using-the-phix-adk-for-lidar-and-datacom-chinese-112/register">Design
  for Packaging: Using the PHIX ADK for LiDAR and Datacom (Chinese)</a>\nDe
 sign for packaging is an important concept in PIC design as it allows you 
 to consider the rules and constraints for packaging from the outset. This 
 is achieved with an Assembly Design Kit (ADK). This integrated approach en
 sures that circuits can be efficiently packaged after fabrication\, elimin
 ating costly mistakes. In this webinar\, you will learn how to design PICs
  for packaging using the PHIX ADK for LiDAR and Datacom applications. PHIX
  will introduce you to the PHIX Characterization package\, and Luceda will
  talk about the design for packaging using Luceda and the PHIX ADK. Regist
 er now for this engaging webinar to explore more about the design for pack
 aging\, and see a demonstration of the design of an optical phase array (O
 PA) and an IQ modulator ready for assembly! Speakers Andrea Alippi Product
  Manager at PHIX Photonics Assembly Biao Li PDK Engineer at Luceda Photoni
 cs Craig Godbold Application Engineer at Luceda Photonics Program 5' Intro
 duction 15' Introduction to PHIX and the PHIX Characterization package And
 rea Alippi - PHIX Photonics Assembly 15' Introduction to Luceda Photonics 
 Biao Li - Luceda Photonics 20' Design for packaging using Luceda and the P
 HIX ADK Biao Li - Luceda Photonics 10' Q&A
DTSTAMP:20260526T022953Z
LOCATION:Online event
SUMMARY:Design for Packaging: Using the PHIX ADK for LiDAR and Datacom (Chi
 nese)
X-ALT-DESC;FMTTYPE=text/html:<a href="https://www.lucedaphotonics.com/event
 /design-for-packaging-using-the-phix-adk-for-lidar-and-datacom-chinese-112
 /register">Design for Packaging: Using the PHIX ADK for LiDAR and Datacom 
 (Chinese)</a>\nDesign for packaging is an important concept in PIC design 
 as it allows you to consider the rules and constraints for packaging from 
 the outset. This is achieved with an Assembly Design Kit (ADK). This integ
 rated approach ensures that circuits can be efficiently packaged after fab
 rication\, eliminating costly mistakes. In this webinar\, you will learn h
 ow to design PICs for packaging using the PHIX ADK for LiDAR and Datacom a
 pplications. PHIX will introduce you to the PHIX Characterization package\
 , and Luceda will talk about the design for packaging using Luceda and the
  PHIX ADK. Register now for this engaging webinar to explore more about th
 e design for packaging\, and see a demonstration of the design of an optic
 al phase array (OPA) and an IQ modulator ready for assembly! Speakers Andr
 ea Alippi Product Manager at PHIX Photonics Assembly Biao Li PDK Engineer 
 at Luceda Photonics Craig Godbold Application Engineer at Luceda Photonics
  Program 5' Introduction 15' Introduction to PHIX and the PHIX Characteriz
 ation package Andrea Alippi - PHIX Photonics Assembly 15' Introduction to 
 Luceda Photonics Biao Li - Luceda Photonics 20' Design for packaging using
  Luceda and the PHIX ADK Biao Li - Luceda Photonics 10' Q&A
END:VEVENT
END:VCALENDAR