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TZID:Europe/Brussels
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DTSTART:20001029T030000
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BEGIN:VEVENT
UID:20260526T023439Z - 40350@eupp208
DTSTART;TZID=Europe/Brussels:20240507T170000
DTEND;TZID=Europe/Brussels:20240507T180000
CREATED:20260526T023439Z
DESCRIPTION:<a href="https://www.lucedaphotonics.com/event/design-for-packa
 ging-using-the-phix-adk-for-lidar-and-datacom-english-111/register">Design
  for Packaging: Using the PHIX ADK for LiDAR and Datacom (English)</a>\nDe
 sign for packaging is an important concept in PIC design as it allows you 
 to consider the rules and constraints for packaging from the outset. This 
 is achieved with an Assembly Design Kit (ADK). This integrated approach en
 sures that circuits can be efficiently packaged after fabrication\, elimin
 ating costly mistakes. In this webinar\, you will learn how to design PICs
  for packaging using the PHIX ADK for LiDAR and Datacom applications. PHIX
  will introduce you to the PHIX Characterization package\, and Luceda will
  talk about the design for packaging using Luceda and the PHIX ADK. Regist
 er now to explore more about design for packaging\, and see a live demonst
 ration of the design of an optical phase array (OPA) and an IQ modulator r
 eady for assembly! Speakers Andrea Alippi Product Manager at PHIX Photonic
 s Assembly Craig Godbold Application Engineer at Luceda Photonics Li Biao 
 PDK Engineer at Luceda Photonics Program 5' Introduction 15' Introduction 
 to PHIX and the PHIX Characterization package Andrea Alippi - PHIX Photoni
 cs Assembly 15' Introduction to Luceda Photonics Craig Godbold - Luceda Ph
 otonics 20' Design for packaging using Luceda and the PHIX ADK Craig Godbo
 ld - Luceda Photonics 10' Q&A
DTSTAMP:20260526T023439Z
LOCATION:Online event
SUMMARY:Design for Packaging: Using the PHIX ADK for LiDAR and Datacom (Eng
 lish)
X-ALT-DESC;FMTTYPE=text/html:<a href="https://www.lucedaphotonics.com/event
 /design-for-packaging-using-the-phix-adk-for-lidar-and-datacom-english-111
 /register">Design for Packaging: Using the PHIX ADK for LiDAR and Datacom 
 (English)</a>\nDesign for packaging is an important concept in PIC design 
 as it allows you to consider the rules and constraints for packaging from 
 the outset. This is achieved with an Assembly Design Kit (ADK). This integ
 rated approach ensures that circuits can be efficiently packaged after fab
 rication\, eliminating costly mistakes. In this webinar\, you will learn h
 ow to design PICs for packaging using the PHIX ADK for LiDAR and Datacom a
 pplications. PHIX will introduce you to the PHIX Characterization package\
 , and Luceda will talk about the design for packaging using Luceda and the
  PHIX ADK. Register now to explore more about design for packaging\, and s
 ee a live demonstration of the design of an optical phase array (OPA) and 
 an IQ modulator ready for assembly! Speakers Andrea Alippi Product Manager
  at PHIX Photonics Assembly Craig Godbold Application Engineer at Luceda P
 hotonics Li Biao PDK Engineer at Luceda Photonics Program 5' Introduction 
 15' Introduction to PHIX and the PHIX Characterization package Andrea Alip
 pi - PHIX Photonics Assembly 15' Introduction to Luceda Photonics Craig Go
 dbold - Luceda Photonics 20' Design for packaging using Luceda and the PHI
 X ADK Craig Godbold - Luceda Photonics 10' Q&A
END:VEVENT
END:VCALENDAR