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Software and services for integrated photonics designers

Foundry PDKs

Foundry PDKs and services for photonic IC designers:

  • Photonic IC designers can obtain Process Design Kits in order to tape-out successfully to their foundry of choice. A wide range of foundries support Luceda software.
  • Support and training on these PDKs. See our training agenda. In addition to public training events we also do one-to-one private trainings on service basis.

Overview Supported PDKs

 

Silicon
(production)
Imec (ISIPP) Towersemi AMF AIMPhotonics
CompoundTek IMECAS SITRI IHP
Silicon
(prototyping)
CORNERSTONE Australian Silicon Photonics
Silicon Nitride
(production)
LigenTec PIX4LIFE BIOPIX
InP
(production)
SMART Photonics HHI
Packaging
     Tyndall

 

 

 

 

 

 

 

 

 

 

 

Your fab of choice not in the list? Contact the foundry team at support@lucedaphotonics.com,

 

Silicon photonics PDKs (production)

We support a range of foundries who can be used for production as well as prototyping. These foundries offer

  • Multi Project Wafer (MPW) services for concept validation and prototyping o
  • One-to-one contracts to move a customer from prototype to product.

Luceda supports these activities with PDK implementations.

Foundries: Imec, IHP, AMF, TowerJazz, IMECAS, SITRI, CompoundTek, AIMPhotonics

 

 

imec ISSIP50G

Current version: 2.3.0.luceda2 (13 Nov 2019) for IPKISS 3.3

Technology used: 220nm SOI.

See http://europractice-ic.com/mpw-prototyping/siphotonics/imec/access-contacts/

Available components:

  • Strip, shallow rib and deep rib waveguides
  • High-speed MZI modulators
  • High-speed Ge photodiode
  • High-speed Ge EAM
  • Thermo-optic tuning
  • 2 levels of metal interconnect
  • Edge coupler

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Technology layers, GDSII
  • Virtual fabrication
  • Predefined components: layout and simulation model
  • Examples

Get the PDK: http://europractice-ic.com/mpw-prototyping/siphotonics/imec/access-contacts/

 

 

 

IHP SG25H4_EPIC

Technology used:

Available components:

  • Rib and strip waveguide (3 etch depths)
  • Phase shifter waveguide
  • High-speed Ge-photodiode, waveguide coupled
  • Grating coupler
  • MMIs
  • 5 metal backend
  • thermo-optic tuning (lowest metal layer)

PDK functionality:

  • IPKISS.flow
  • Technology layers, GDSII
  • Generic PCells with meaningful default values (C-band, O-band)
  • Basic simulation models for most PCells
  • Examples, documentation
  • Advanced simulation models in preparation

IHP organizes regular training sessions

Get the PDK: https://dk.ihp-microelectronics.com/contact.htm

 

 

AMFSIP

Latest version: 3.0

Technology used: 220nm SOI, Ge epi, SiN, TiN heater, 2 metal, deep trench and undercut etching
Customized process available.

Available components:

  • C-band + O-band
  • Channel, shallow slab and deep slab waveguides
  • Ge PD 25GHz and 50GHz BW
  • MZI modulator 25GHz BW
  • 50;50 Power splitter
  • Polarisation manipulation devices
  • 90 degree mixer
  • Grating coupler and suspended edge coupler
  • Heaters
  • VOA
  • SOI crossings
  • SiN crossings
  • SiN MMI
  • SiN grating couplers

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Schematic-driven design and layout (S-Edit)
  • Schematic driven simulation (IPKISS 3.3)
  • Technology layers, GDSII
  • Virtual fabrication
  • Predefined components: layout and simulation model
  • Examples

Get the PDK: libo@advmf.com

 

CompoundTek

Latest version: 3.7 (requires IPKISS 3.3)

Technology used: 220nm SOI + SiN layers, modulator implants, Ge photodiode, heater, metallization, edge coupler

Several back-end flavors available: Cu 2ML, Cu 3ML, Al 2ML

Available components:

  • C-band + O-band
  • Silicon and silicon nitride waveguides (strip and rib)
  • Waveguide transitions
  • Crossing
  • Directional coupler
  • Edge coupler
  • Grating coupler
  • MMI
  • MZI modulators
  • Ring modulator
  • Ge photodiodes (lateral and vertical)
  • Thermo-optic phase shifter
  • Doped Si heater

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Technology layers, GDSII
  • Virtual fabrication
  • Predefined components: layout
  • Examples

Get the PDK: support@lucedaphotonics.com

 

 

Towersemi PH18

Latest version: being updated

Technology used: SOI + SiN layers, modulator. photodiode, heater, multi-level metallization

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Technology layers, GDSII
  • Virtual fabrication
  • Predefined components: layout
  • Examples

Get the PDK: support@lucedaphotonics.com

 

 

AIMPhotonics

SUNY Polytechnic Institute / AnalogPhotonics PDK for AIMphotonics.

Several flavors are available, matching the MPW runs of AIMPhotonics: full build, passives, and active interposer

Latest version: 3.5a

Technology used: silicon and silicon nitride photonics + interposer

Available components:

  • C-band + O-band
  • Silicon and silicon nitride waveguides (strip and rib)
  • Waveguide transitions, crossings and terminations
  • Splitters, y-junctions, power taps
  • Grating and edge couplers
  • Polarisation handling
  • MZI modulators
  • Microdisk modulators
  • photodetectors
  • Thermo-optic phase shifters and switches
  • variable optical attenuators
  • Resonant filters and switches

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Technology layers, GDSII
  • Virtual fabrication (passives, interposer metalization)
  • Library devices: all layout cells implemented for all technology flavors.
  • Examples

Get the PDK from AIM Photonics: http://www.aimphotonics.com/aim-photonics-pdk-access

 

 

IMECAS

Technology used: 220nm SOI, 200mm wafer size

See http://siplatform.cn/

Available technology:

  • Passive: 220nm/150nm/70nm etch depths + SiO2 cladding
  • Passive+heater: Passive + TiN heater and AlCu metal and bondpad
  • Active: Passive+heater + 3 doping levels P+N, Ge epi, via, metal, bondpads, deep etch

Available components:

  • Waveguides
  • Grating coupler
  • Edge coupler
  • MMI
  • Ge photodiode
  • Modulator

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Design manual
  • Technology layers, GDSII
  • DRC deck
  • Predefined components: layout and simulation model for some components
  • Examples

Get the PDK: support@siplatform.cn

 

 

Silicon photonics (prototyping)

We support several fab facilities which can be used for research and prototyping. These typically offer multi-project wafer or fast electron beam based prototyping. Often, they are more flexible than production foundries.

Luceda supports these activities with PDK implementations.

Foundries: CORNERSTONE, Australian Silicon Photonics, SiEPIC

 

 

CORNERSTONE

The CORNERSTONE project offers fast prototyping of silicon photonic circuits in 220nm, 340 and 500nm SOI platforms in regular MPW runs, supporting both passive and active devices. 
The platform offers process flexibility and customisation, and the opportunity for bespoke fabrication batches.

See http://www.cornerstone.sotonfab.co.uk. for schedule, pricing and design rules

Available components (C and O band):

  • Rib and strip waveguides
  • Rib-strip transition
  • MMI
  • Grating coupler
  • Heaters (filament & contact pads)
  • High-speed modulators

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Technology layers, GDSII
  • Virtual fabrication (including waveguides, implants and metallization)
  • Predefined components (layout)
  • Pcells for easy layout
  • Examples (photonic crystal, ring resonator parameter sweep, ...)

Get the PDK: support@lucedaphotonics.com

 

 

Australian Silicon Photonics

Australian silicon photonics offers fast prototyping of silicon photonic circuits in 220nm SOI.

Available components:

  • Rib and strip waveguides: full etch or 70nm etch depth
  • Grating couplers
  • 1x2, 2x2 MMIs
  • Waveguide crossing

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Technology layers, GDSII
  • Virtual fabrication
  • Predefined components (layout and simulation models)
  • Pcells for easy layout
  • Examples (incl. jupyter notebooks)
  • KLayout tech settings

See http://www.siliconphotonics.com.au/ for more information.

Get the PDK: info@siliconphotonics.com.au

 

 

Silicon nitride (production)

We support foundries which can be used for production as well as prototyping. These foundries offer

  • Multi Project Wafer (MPW) services for concept validation and prototyping.
  • One-to-one contracts to move a customer from prototype to product.

Luceda supports these activities with PDK implementations.

Foundries: LigenTec, Imec(BIOPIX), LioniX (upcoming)

 

 

Ligentec

Technology used: 800nm Silicon Nitride ("AN800") and 150nm Silicon Nitride ("AN150")

See http://www.ligentec.com

Available foundry defined components:

  • Waveguides: straight, arc, sine bend
  • Edge coupler
  • 1x2 and 2x2 MMI
  • Future (ask Ligentec for availability): heater module, AWG

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Technology layers, GDSII
  • Virtual fabrication
  • Predefined black-box components (layout)
  • Luceda pcells: directional coupler, ring resonator
  • Examples (ring resonator, spiral, ...)

Get the PDK: support@lucedaphotonics.com

 

 

imec BioPIX

Technology used: 300nm (BIOPIX300) or 150nm (BIOPIX150) Silicon Nitride

See http://pix4life.eu/index.php/access/services

Available components:

  • Waveguides
  • Grating coupler
  • Directional coupler

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Technology layers, GDSII
  • Virtual fabrication
  • Predefined components: layout and simulation model
  • Examples (photonic crystal, ring resonator parameter sweep, ...)

Get the PDK: support@lucedaphotonics.com

Current PDK version: 0.4.3

 

Indium Phosphide (production)

We support foundries which can be used for production as well as prototyping. These foundries offer

  • Multi Project Wafer (MPW) services for concept validation and prototyping.
  • One-to-one contracts to move a customer from prototype to product.

Luceda supports these activities with PDK implementations.

Foundries: SMARTPhotonics, HHI (upcoming)

 

 

SmartPhotonics

Technology used: InP

See http://www.smartphonics.nl/

Multi project wafer access via JePPIX: http://www.jeppix.eu

Available technology:

  • C-band active device technology
  • Passive-Active integration

Available components:

  • Waveguides: strong and weakly guiding
  • Chip facets
  • Splitters and reflectors
  • SOA 
  • PIN photodiode
  • EO phase modulator
  • Electrical isolation
  • Active-passive transitions

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Design manual
  • Technology layers, GDSII
  • DRC deck
  • Predefined components: black-box layout cells, waveguides and example simulation models
  • Examples

Get the PDK: support@lucedaphotonics.com

 

Fraunhofer HHI

Technology used: InP (semi-insulating substrate)

See www.hhi.fraunhofer.de/en/departments/pc/research-groups/photonic-inp-foundry.html

Multi project wafer access via JePPIX: http://www.jeppix.eu

Available technology:

  • C-band active device technology
  • Passive-Active integration

Available components:

  • Waveguides: 3 waveguide types (stronger and weaker guiding)
  • Spot size converter
  • Couplers
  • Transitions and crossings
  • Polarization handling
  • PIN photodiodes
  • Phase and amplitude modulators
  • Lasers (DFB, DBR)
  • SOAs
  • Tunable grating
  • Active isolations

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Design manual
  • Technology layers, GDSII
  • DRC deck
  • Predefined components: black-box layout cells, waveguides, routing
  • Examples

Get the PDK: support@lucedaphotonics.com

 

 

Packaging

In addition to photonic IC foundry PDKs, Luceda also offers PDKs for packaging service providers. These contain design rules, templates and other utilities to design a chip so it's compatible with a packaging service provider of choice.

Currently, we support Tyndall Institute.

 

 

Tyndall

This is a packaging PDK following the Tyndall National Institute design rules. It facilitates silicon photonics fiber attach, electrical wirebonding and mounting on standardized testbench platforms

PDK functionality:

  • IPKISS.eda (L-Edit + Python) and IPKISS.flow (Python) support
  • Technology layers, GDSII
  • Tyndall packaging templates:
    • Single Fiber
    • Fiber array
    • Bondpads
    • Die template with design rule checking

Get the PDK: support@lucedaphotonics.com

 

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